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The Chip EQUIP Act prohibits semiconductor manufacturers that receive federal financial assistance from purchasing completed semiconductor manufacturing equipment from foreign entities of concern or their subsidiaries. The bill defines ineligible equipment to include items such as deposition, etching, lithography, and inspection equipment used in semiconductor production. The Secretary may waive these restrictions if equivalent equipment is unavailable from U.S. or allied sources, or if use complies with export regulations and serves the national security interest.
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