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The Chip EQUIP Act prohibits recipients of federal semiconductor manufacturing assistance from purchasing certain completed semiconductor manufacturing equipment from foreign entities of concern or their subsidiaries for 10 years. The bill defines ineligible equipment to include deposition, etching, lithography, inspection, and other specialized fabrication tools manufactured or assembled by foreign entities of concern. The Secretary may waive these prohibitions if equivalent equipment is unavailable domestically or from allied countries, if the equipment was originally manufactured by a non-concern entity and only refurbished by a concern entity, or if use complies with export regulations and serves U.S. national security interests.
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