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The Chip EQUIP Act prohibits recipients of federal semiconductor manufacturing assistance from purchasing certain completed semiconductor manufacturing equipment from foreign entities of concern or their subsidiaries for 10 years. The bill defines ineligible equipment to include deposition, etching, lithography, inspection, and other specialized fabrication tools. The Secretary may waive the prohibition if equivalent equipment is unavailable from U.S. or allied sources, if the equipment was originally made outside a foreign entity of concern and only refurbished by one, or if use complies with export regulations and serves U.S. national security interests.
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